Technology assessment on the effects of refinishing lead-free microelectronic components – Stage 2

£117,000 (2013-14)

This work will develop virtual prototyping technologies that will allow the centre’s industrial partners (Rolls Royce, Cassidian and Micross Semiconductors Ltd) to accurately assess the reliability of commercial off-the-shelf electronic components before they are deployed in high reliability applications such as aeroplanes, satellites, etc.


€350,000 (2013–17)

Funded by the European Commission (Grant Number 608995) as part of a €3.5m multi-partner project, this project will develop additive manufacturing technology based on 3D-inkjet printing that will be used to fabricate the next generation of electronic products for use in the medical and energy sectors. The group will develop the NextFactory software tools that will predict the behaviour of the materials in this process which extend the group’s computational reliability expertise.

Underpinning power electronics

£500,000 (2013–19)

This flagship EPSRC initiative, worth over £18m over seven years (£8m is currently committed) is being undertaken in collaboration with Nottingham, Cambridge, Newcastle, Manchester, Bristol, Strathclyde and Warwick universities. CMRG will lead the design, modelling and simulation efforts in this project. The work will investigate the reliability of new power electronics components and systems that underpin the Government’s energy agenda. This is particularly important for future energy requirements in transport, cities, etc.


€200,000 (2011–13)

The project is funded by the EU Clean Sky initiative (Project Number 271788). The group has developed physics-of-failure models and numerical optimisation software to predict the reliability of new power electronics components.

RODENT: Damage mechanics models for power electronic module reliability, funded by EPSRC/IeMRC

£210,000 (2012–15)

This is a collaborative project with the University of Nottingham. The University of Greenwich is developing damage mechanics models that will predict crack initiation and growth in electronic interconnects.