Publications and reports

Recent publications

Stoyanov, Stoyan; Bailey, Christopher; Stewart, Paul; Parker, Mike and Roulston, John F. (2020) Experimental and modelling study on delamination risks for refinished electronic packages under hot solder dip loads. IEEE. ISSN 2156-3950

Shahjalal, Mohammad; Rishad Ahmed, MD; Lu, Hua; Bailey, Chris and Forsyth, Andrew (2020) An analysis of the thermal interaction between components in power converter applications. IEEE. ISSN 0885-8993

Ahsan, M.; Stoyanov, S.; Bailey, C. and Albarbar, A. (2020) Developing computational intelligence for smart qualification testing of electronic products. IEEE.

Hinojosa Herrera, Ana Elsa; Stoyanov, Stoyan; Bailey, Christopher; Walshaw, Christopher and Yin, Chunyan (2019) Data analytics to reduce stop-on-fail test in electronics manufacturing. De Gruyter Open.

Bailey, Christopher; Yin, Chunyan and Rajaguru, Pushparajah (2019) Predicting damage and life expectancy of subsea power cables in offshore renewable energy applications. IEEE.

Tonry, Catherine E. H.; Patel, Mayur K.; Yu, Weixing; Desmulliez, Marc P. Y. and Bailey, Christopher (2019) Fabrication of hollow polymer microstructures using dielectric and capillary forces. Springer Berlin Heidelberg. ISSN 0946-7076

Stoyanov, Stoyan; Ahsan, Mominul; Bailey, Chris; Wotherspoon, Tracy and Hunt, Craig (2019) Predictive analytics methodology for smart qualification testing of electronic components. Springer US. ISSN 0956-5515

Nwanoro, Kenneth C.; Lu, Hua; Yin, Chunyan and Bailey, Chris (2018) Using FloTHERM XT and ANSYS workbench to perform Thermo-Mechanical analysis. Mentor Graphics.

Blanche, Jamie; Flynn, David; Lewis, Helen; Couples, Gary; Buckman, Jim; Bailey, Chris and Tilford, Timothy (2018) Analysis of sandstone pore space fluid saturation and mineralogy variation via application of monostatic K-band frequency modulated continuous wave radar. IEEE.

Desmulliez, Marc P.Y; Adamietz, Raphael; Pavuluri, Sumanth K.; Tilford, Tim; Bailey, Chris; Schreier-Alt, Thomas and Warmuth, Jens (2018) Reliability testing and stress measurement of QFN packages encapsulated by an open-ended microwave curing system. Institute of Electrical and Electronics Engineers, Inc.. ISSN 2156-3950

Santhanakrishnan, Mani Sekaran; Tilford, Timothy and Bailey, Christopher (2018) Performance assessment of density and level-set topology optimisation methods for 3D heatsink design. SAGE Publications. ISSN 1748-3018

Nwanoro, Kenneth; Lu, Hua; Yin, Chunyan and Bailey, Chris (2018) An analysis of the reliability and design optimization of aluminium ribbon bonds in power electronics modules using computer simulation method. Elsevier. ISSN 0026-2714

Tilford, Tim; Stoyanov, Stoyan; Braun, Jessica; Janhsen, Jan Cristophe; Burgard, Matthias; Birch, Richard and Bailey, Chris (2018) Design, manufacture and test for reliable 3D printed electronics packaging. Elsevier Ltd.. ISSN 0026-2714

Rajaguru, P.; Lu, H.; Bailey, C.; Castellazzi, A.; Pathirana, V.; Udugampola, N. and Udrea, F. (2018) Impact of underfill and other physical dimensions on Silicon Lateral IGBT package reliability using computer model with discrete and continuous design variables. Elsevier. ISSN 0026-2714

Lu, Hua and Bailey, Christopher (2017) Failure and reliability analysis of a SiC power module based on stress comparison to a Si device. Institute of Electrical and Electronics Engineers (IEEE). ISSN 1530-4388

Rajaguru, Pushparajah; Ortiz-Gonzalez, Jose Angel; Lu, Hua; Bailey, Chris and Alatise, Olawiwola (2017) A multiphysics modeling and experimental analysis of pressure contacts in power electronics applications. Institute of Electrical and Electronics Engineers (IEEE). ISSN 2156-3950

Ortiz Gonzalez, Jose; Alatise, Olayiwola; Aliyu, Attahir; Rajaguru, Pushparajah; Castellazzi, Alberto; Ran, Li; Mawby, Philip and Bailey, Chris (2017) Evaluation of SiC Schottky diodes using pressure contacts. Institute of Electrical and Electronics Engineers (IEEE). ISSN 0278-0046

Rajaguru, P.; Lu, H.; Bailey, C.; Ortiz-Gonzalez, J. and Alatise, O. (2016) Evaluation of the impact of the physical dimensions and material of the semiconductor chip on the reliability of Sn3.5Ag solder interconnect in power electronic module: A finite element analysis perspective. Elsevier. ISSN 0026-2714

Stoyanov, Stoyan; Bailey, Chris and Tourloukis, Georgios (2016) Similarity approach for reducing qualification tests of electronic components. Elsevier. ISSN 0026-2714

Jones, Thomas D.A.; Flynn, David; Desmulliez, Marc P.Y.; Price, Dennis; Beadel, Matthew; Strusevich, Nadia; Patel, Mayur; Bailey, Chris and Costello, Suzanne (2016) Morphology and acoustic artefacts of copper deposits electroplated using megasonic assisted agitation. Emerald. ISSN 0305-6120

Rajaguru, Pushparajah; Lu, Hua and Bailey, Christopher (2015) A time dependent damage indicator model for Sn3.5Ag solder layer in power electronic module. Elsevier Ltd.. ISSN 0026-2714

Stoyanov, S. and Bailey, C. (2015) Modelling the impact of refinishing processes on COTS components for use in aerospace applications. Elsevier. ISSN 0026-2714

Rajaguru, Pushparajah; Lu, Hua and Bailey, Chris (2015) Sintered silver finite element modelling and reliability based design optimisation in power electronic module. Elsevier Ltd.. ISSN 0026-2714

Yin, Chunyan; Best, Chris; Bailey, Chris and Stoyanov, Stoyan (2015) Statistical analysis of the impact of refinishing process on leaded components. Elsevier Ltd.. ISSN 0026-2714

Musallam, Mahera; Yin, Chunyan; Bailey, Christopher and Johnson, Mark (2014) Mission profile-based reliability design and real-time life consumption estimation in power electronics. Institute of Electrical and Electronics Engineers, Inc.. ISSN 0885-8993

Zhu, X.; Kotadia, H.; Xu, S.; Lu, H.; Mannan, S. H.; Bailey, C. and Chan, Y. C. (2014) Electromigration in Sn-Ag solder thin films under high current density. Elsevier B.V.. ISSN 0040-6090

Rajaguru, Pushparajah; Lu, Hua and Bailey, Christopher (2014) Application of nonlinear fatigue damage models in power electronic module wirebond structure under various amplitude loadings. Shanghai University. ISSN 2095-3127

Stoyanov, Stoyan; Bailey, Christopher; Waite, Rhys; Hicks, Christopher and Golding, Terry (2020) Packaging challenges and reliability performance of compound semiconductor focal plane arrays. In: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC). IEEE. ISBN 978-0956808660

Hinojosa Herrera, Ana Elsa; Walshaw, Chris; Bailey, Chris and Yin, Chunyan (2019) Failure mode & effect analysis for improving data veracity and validity. In: Proceedings of the IEEE International Conference on Computing, Electronics & Communications Engineering 2019 (IEEE iCCECE '19). IEEE. ISBN 978-1728121383

Rajaguru, Pushparajah; Santhanakrishnan, Manisekaran; Tilford, Tim and Bailey, Chris (2019) Design of additively manufactured heatsinks for power electronics thermal management using adjoint level-set topology optimization. In: 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). IEEE. ISBN 978-1728120782 ISSN 2474-1515

Hinojosa Herrera, Ana Elsa and Stoyanov, Stoyan (2019) Data driven predictive model to compact a production stop-on-fail test set for an electronic device. In: Proceedings of the 2018 International Conference on Computing, Electronics & Communications Engineering (iCCECE). IEEE Xplore. ISBN 9781538649046

Nwanoro, Kenneth Chimezie; Lu, Hua; Yin, Chunyan and Bailey, Christopher (2018) Numerical simulation of the junction temperature, the coolant flow rate and the reliability of an IGBT module. In: 2018 24th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC 2018). IEEE. ISBN 978-1538667606

Nwanoro, Kenneth C.; Lu, Hua; Yin, Chunyan and Bailey, Christopher (2018) An approximate numerical method for the prediction of plastic strain in layered structures. In: 2018 7th Electronic System-Integration Technology Conference (ESTC 2018). IEEE. ISBN 978-1538668153

Ahsan, Mominul; Stoyanov, Stoyan and Bailey, Christopher (2018) Data driven prognostics for failure of power semiconductor packages. In: Proceedings of 41st Spring Seminar on Electronics Technology (ISSE). IEEE Xplore. ISBN 978-1-5386-5730-0

Tilford, T.; Bruan, J.; Janhsen, J. C.; Burgard, M. and Bailey, C. (2018) SPH analysis of inkjet droplet impact dynamics. In: Proceedings of the 13th World Congress on Computational Mechanics (WCCM XIII) and 2nd Pan American Congress on Computational Mechanics (PANACM II). WCCM.

Stoyanov, Stoyan; Ahsan, Mominuil and Bailey, Chris (2018) Data analytics approach for optimal qualification testing of electronic components. In: Proceedings EuroSimE 2018. IEEE Xplore. ISBN 978-1-5386-2358-9

Nwanoro, Kenneth Chimezie; Lu, Hua; Yin, Chunyan and Bailey, Christopher (2017) Computer simulation of the reliability of wire bonds and ribbon bonds in power electronics modules. In: 2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). IEEE. ISBN 978-1-5386-1929-2

Shahjalal, Mohammad; Lu, Hua and Bailey, Christopher (2017) Electro-thermal modelling of multi chip power modules for high power converter application. In: 2017 18th International Conference on Electronic Packaging Technology (ICEPT), Harbin. IEEE. ISBN 978-1-5386-2973-4

Yin, Chunyan; Stoyanov, Stoyan; Bailey, Christopher and Stewart, Paul (2017) Modelling the impact of conformal coating penetration on QFN reliability. In: 2017 18th International Conference on Electronic Packaging Technology (ICEPT). IEEE. ISBN 978-1-5386-2973-4

Rajaguru, P.; Bailey, C.; Lu, H.; Aliyu, A. M.; Castellazzi, A.; Pathirana, V.; Udugampola, N.; Trajkovic, T.; Udrea, F.; Mitcheson, P. D. and Elliott, A. D. T. (2017) Co-design/simulation of flip-chip assembly for high voltage IGBT packages. In: 23rd International workshop on Thermal Investigations of ICs and Systems (THERMINIC). THERMINIC.

Stoyanov, Stoyan and Bailey, Christopher (2017) Machine learning for additive manufacturing of electronics. In: Proceedings 2017 40th International Spring Seminar on Electronics Technology (ISSE). IEEE. ISBN 978-1-5386-0583-7

Aliyu, A. M.; Mouawad, B.; Castellazzi, A.; Rajaguru, P.; Bailey, C.; Pathirana, V.; Uduampola, N.; Trajkovic, T. and Ubrea, F. (2017) Chip-on-board assembly of 800V Si LIGBTs for high performance ultra-compact LED drivers. In: Proceedings of the 2017 29th International Symposium on Power Semiconductor Devices and IC's (ISPSD). IEEE. ISBN 978-4-88686-094-1

Tilford, T.; Stoyanov, S.; Tourloukis, G. and Bailey, C. (2016) Numerical analysis of droplet deposition in inkjet printed electronics assembly. In: 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE. ISBN 978-1-5090-2106-2

Bailey, C.; Stoyanov, S.; Tilford, T. and Tourloukis, G. (2016) Modelling methodologies for quality assessment of 3D inkjet printed electronic products. In: 3rd Fraunhofer Direct Digital Manufacturing Conference, DDMC 2016. Proceedings. Fraunhofer Verlag, Stuttgart. ISBN 978-3-8396-9128-1

Rajaguru, P.; Lu, H.; Bailey, C.; Ortiz-Gonzalez, J. and Alatise, O. (2016) Electro-thermo-mechanical modelling and analysis of the Press Pack Diode in Power Electronics. In: 2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). IEEE. ISBN 978-1-4673-9706-3

Rajaguru, Pushparajah; Mason, Peter; Bailey, Christopher and Stoyanov, Stoyan (2012) Structural Analysis on the Riveted Hull of the Paddle Steamer Medway Queen. In: Historic Ships Conference 2012. Royal Institution of Naval Architects (RINA).

Tonry, Catherine Elizabeth Henzell (2015) Computational electrohydrodynamics for fabricating polymer microstructures.

Rajaguru, Pushparajah (2014) Reduced order modelling and numerical optimisation approach to reliability analysis of microsystems and power modules.

Santhakrishnan, M.; Tilford, T. and Bailey, C. (2016) On the Application of Topology Optimisation Techniques to Thermal Management of Microelectronics Systems.

Tilford, Timothy; Cook, A.; Lu, H.; Ramambasoa, A. and Conseil, F. (2014) Numerical analysis of the performance of highly oriented pyrolytic graphite heat spreader in thermal management of microelectronics assemblies. In: Proceedings of the 5th Electronics System-integration Technology Conference (ESTC).