Christopher Bailey

Professor Christopher Bailey

Christopher Bailey

Professor Christopher Bailey


Department of Mathematical Sciences

Faculty of Architecture, Computing and Humanities

Professor Bailey obtained his Degree in Mathematics, Statistics and Computing (1984) and his PhD is Computational Modelling (2008) from Thames Polytechnic. He then joined Carnegie Mellon University as a Research Fellow within the Department of Materials Science from 1988-1991. Returning to the UK he joined the University of Greenwich as Senior Research Fellow and in 2001 he obtained a Professorship in Computational Mechanics and Reliability.

Professor Bailey is Director of the Computational Mechanics and Reliability Group at the University of Greenwich managing a team of 16 academic staff, research fellows and PhD students. The group focuses its research efforts on the development of design and modelling tools for predicting the performance, reliability and maintainability of engineering processes, components and systems. This includes the development of software tools such as PHYSICA, ROMARA and Powerlife.

Chris is a member of the NAFEMS Multi-Physics Modelling working group, represents Europe on the board of governors of IEEE-CPMT, is a member of the INEMI Roadmap team, Chair of the UK&RI IEEE CPMT/Reliability chapter, and an associate editor of the IEEE CPMT Transactions. He is also a member of a number of IEEE conference committees which includes EuroSime, ESTC and EPTC. He has published over 200 papers in the field of modeling and reliability of micro-technology based processes and products and consults with a number of companies worldwide. He is also an executive member of the EPSRC funded Innovative Electronics Manufacturing Research Centre.


PhD Computational Modelling
MBA Technology Management

Member of the University Research and Enterprise committee

Director of Computational Mechanics and Reliability Group

Knowledge Transfer Partnership Award for London (2008) 

Times Higher Education Award for Outstanding UK Engineering Research Team of the year (2009), sponsored by BAeSystems

Best paper awards at the IEEE conferences including: International Conference on Electronic Packaging Technology - 2009 - for the paper Impact of Assembly Processes on Polymer Materials in Electronic Packaging, by T Tilford, C Bailey, K Parrot.

- Board of Governors Member of the IEEE-CPMT Society 

- IEEE-CPMT Strategic Director for Student Programmes 

- Chair of the UK&RI IEEE-CPMT/Reliability chapter 

- Associate Editor of IEEE-CPMT Transactions

- National Agency for Finite Element Analysis (NAFEMS) working group member for Multi-Physics Modelling.

- IEEE (Senior Member)

- IET (Member)

Computational Mechanics 

Multi-physics modelling

Engineering Reliability

Prognostics and Health Management


Embedded and Smart Systems

Maritime Engineering

Structural Analysis

Micro and Nano Systems

Additive Manufacturing

Funded research projects

 1. Lead-Free Processing of COTS components, (2013-2014), Funded by GDAIS (USA) ($170,000)This project is developing a modelling approach to predicting the reliability of COTS electronic components to ensure they are suitable for high reliability applications. 

2. NextFactory (2013-2017), Funded by EU-FP7 350,000 eurosDevelopment of multi-physics models and condition monitoring software for 3D ink-jet printing of microsystem components. 

3. EPSRC Underpinning Power Electronics (2013-2019)- HUB, Funded by EPSRC: 64,000 UK SterlingSupports Professor Bailey on the executive committee of this �18M initiative funded by the EPSRC,

4. EPSRC Underpinning Power Electronics - Components Theme (2013-2017), Funded by EPSRC: 450,000 UK SterlingSupports development of multi-physics models and development of reliability software such as PowerLife for next generation of power electronic components.

5. RODENT: Damage mechanics models for power electronic module reliability, funded by EPSRC/IeMRC (2012-2015): 210,000 UK Sterling Supports the development of damage mechanics models that will predict crack initiation and growth in electronic interconnects

6. Subsea Cables: Funded by SSE (2012-2014) : 144,000 UK SterlingDevelopment of models to predict reliability of subsea power cables. Also the development of software that embeds these models for use by SSE staff.

7. PEMREL: Reliability and Risk Analysis of Power Electronics Modules; Funded by EU Framework 7 (2011 - 2013) 200,000 euros Development of physics of failure models and the PowerLife software for power electronics modules. 

8. COTS components for High Reliability Applications; Funded by GDAIS (USA) (2010 - 2013) US$250,000 Numerical analysis of the hot solder dipping process for refinishing electronic components that will be used in high reliability applications. 

9. Thermal Management and Optical Interconnects for Defence Electronics (2011-2013); funded by MOD and DGA (France) 90,000 UK SterlingThermal modelling and reliability predictions of electronic components which are subjected to harsh defence environments. 

10. FAMOBS; Frequency Agile Microwave Bonding System; Development of Multi-Physics Models for Microwave Bonding of Adhesives in Electronic Packaging; Funded by EU-FP7; (2008-2011) 250,000 UK Sterling Multi-physics modelling of a novel microwave heating process for use in manufacture of electronic packages. 

11. Modelling of Power Modules, TSB funded project developing reliability models for Power Electronics Modules (2006-2009) - 220,000 UK SterlingDevelopment of reliability/robustness models for power electronics components. This was the start of the PowerLife software development. 

12. Power Electronics Flagship, EPSRC/IeMRC funded project investigating the reliability of power electronics modules (2005-2010) - 184,000 UK SterlingPhysics of failure models for predicting behaviour of power electronic components. 

13. Prognostics for Power Electronics Modules, EPSRC/IeMRC funded project investigating models for health monitoring of power electronic systems (2008-2010) - 122,000 UK Sterling Development of both model and data driven algorithms for maintaining power electronic components in the field in real time.

14. 3D-Mintegration; EPSRC Grand Challenge Project on Micro-Engineered Products (2006 - 2010); 400,000 UK Sterling Development of modelling techniques for 3D miniaturised components. This was and EPSRC Grand Challenge project.

15. Design for Manufacture of System in Package (SiP) Technologies; Funded by IeMRC (2007-2009); 120,000 UK Sterling Development of models for SiP packages in collaboration with Lancaster University, Selex and NXP.

16. ENDVIEW; Development of Multi-Physics Modelling Techniques for Liquid Crystal Displays with LED Backlights; Funded by TSB (2008-2010); 86,000 UK SterlingDevelopment of multi-physics models to predict the behaviour if ruggedized displays for use in the aerospace sector. 

17. MEMSA; Modelling the Electro-deposition for Microsystems Applications; Funded by EPSRC (2006-2009); 180,000 UK Sterling Development of multi-physics models to predict the quality of the electroplating manufacturing process as used to fabricate Microsystems components.

18. Long-Life: Reliability of Semiconductor Devices; Funded by Prime Ministers Collaboration Initiative with Kyoto University, Japan (2009 - 2011); 40,000 UK 

Sterling Funding provided to collaborate with Kyoto University (Japan) to investigate novel measurement and modelling techniques for predicting reliability of electronic components.

N Strusevich, M Desmulliez, E Abraham, D Flynn, T Jones, M Patel, C Bailey, (2013) Electroplating for high aspect ratio vias in PCB manufacturing: Enhancement capabilities of acoustic streaming, Jnl for Advances in Manufacturing, Pub Springer, DOI: 10.1007/s40436-013-0039-9

S Costello, N Strusevich, D Flynn, R Kay, M Patel, C Bailey, D Price, M Bennet, A Jones, M Desmulliez M. (2013) Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation, Microsystem Technologies, In Press, doi:10.1007/s00542-013-1746-7

S. Stoyanov, C. Bailey, M.O. Alam, C. Yin, C. Best, P. Tollafield, R. Crawford, M. Parker and J. Scott (2013) "Modelling methodology for thermal analysis of hot solder dip process", Microelectronics Reliability, Vol. 53, 2013, pp. 1055-1067 (DOI: 10.1016/j.microrel.2013.02.018)

H Chen, W Yu, S Cargill, M Patel, C Bailey, C Tonry (2012), Self-encapsulated hollow microstructures formed by electric field-assisted capillarity, Microfluid Nanofluid, Vol. 13, pp. 75-82

T Sutharssan, S Stoyanov, C Bailey, Y Rosunally (2012), Prognostics and health monitoring of high power LED, Micromachines 3 (1), pp 78-100. 

P Rajaguru H Lu, C Bailey, C(2012) "Application of Kriging and radial basis function in power electronic module wire bond structure reliability under various amplitude loading", INTERNATIONAL JOURNAL OF FATIGUE Volume: 45 Pages: 61-70 

S Stoyanov, T Tilford, F Amalou, S Cargill, C Bailey and M Desmulliez (2011); Modelling and optimisation study on the fabrication of nano-structures using imprint forming process. International Journal for Engineering Computations, 28 (1). pp. 93-111 

X Xue, M Patel, C Bailey and M Desmulliez (2011), Geometrical optimisation of a biochip microchannel fluidic separator, Computer Methods in Biomechanics and Biomedical Engineering , 27, (11) pp1771-1792 

Y Rosunally, S Stoyanov, C Bailey (2011) Fusion approach for prognostics framework of heritage structures, IEEE Transactions on Reliability, 60, (1), pp3-13 

X Xue, S Marson, M Patel, C Bailey, W O'Neill, D Topham, R Kay and M Desmulliez; (2011) Progress towards the design and numerical analysis of a 3D microchannel 3 biochip separator, Int Journal for Numerical Methods in Bio Engineering, (2011) DOI: 10.1002/cnm 

X. Xue, C. Bailey, H. Lu and S. Stoyanov (2011) "Integration of analytical techniques in stochastic optimization of microsystem reliability", Microelectronics Reliability, Vol. 51, 2011, pp. 936-945 (DOI:10.1016/j.microrel.2011.01.008)

C Yin, H Lu, M Musallam, C Bailey, M Johnson, (2010) Prognostics Reliability Analysis of Power Electronics Modules, Int. Journal of Performability Engineering, Vol 6, No. 5, pp 513-524 

E Kamara, H Lu, C Bailey, C Hunt, D Di Maio, O Thomas, (2010), A Multi-Disciplinary Study of Vibration Based Reliability of Lead-Free Interconnects, Microelectronics Reliability, Vol 50, No. 9, pp1706-1710 

M Rizvi, C Bailey, H Lu, (2010), Damage predictions in a Chip Resistor Solder Joint on Flexible Substrate Board, 

Microelectronic Engineering, Vol 87, pp 1889-1895 

S Stoyanov, P Mason, C Bailey (2010), Smeared shell modelling approach for structural analysis of heritage composite structures - an application to the Cutty Sark conservation, Computers and structures, 88 (11-12), pp 649-663 

S. Stoyanov, C. Bailey, Y K Tang, S. Marson, A. Dyer, D. Allen and M. Desmulliez (2010) "Computational modelling and optimisation of the fabrication of nano-structures using focused ion beam and imprint forming technologies", Journal of Physics: Vol. 253, No.1, 012008 (ISSN 1742-6588 (Print), ISSN 1742-6596 (Online), DOI: 10.1088/1742-6596/253/1/012008 )

M. Hughes, N. Strussevitch, C Bailey, K McManus, J Kaufmann, D Flynn, and M Desmulliez, (2010) Numerical algorithms for modelling electrodeposition: Tracking the deposition front under forced convection from megasonic agitation. International Journal for Numerical Methods in Fluids, n/a. doi: 10.1002/fld.2140 

T. Tilford, M. Ferenets, J. E. Morris, A. Krumme, S. Pavuluri, P. R. Rajaguru, M. P. Y. Desmulliez and C. Bailey, (2010) Application of Particle Swarm Optimisation to Evaluation of Polymer Cure Kinetics Models, Journal of Algorithms & Computational Technology Vol. 4 No. 1, pp 121-146 

M Alam, H Lu, C Bailey, Y Chan, (2009), Fracture Mechanics Analysis of Solder Joint Intermetallic Compounds in Shear Test, Computational Materials Science, Vol 45, No. 2, pp 576-583. 

M Alam, H Lu, C Bailey, and Y Chan(2009) " Finite-Element Simulation of Stress Intensity Factors in Solder Joint Intermetallic Compounds", IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, Vol. 9, Issue 1, pp 40-48

X Xue, C Bailey, M Turitto, S Ratchev, (2009), Modelling and optimization of a pneumatic microfeeder system, Int Journal for Simulation and Multidisciplinary Design Optimisation, V 3, No. 1, pp 307-315 

J Kaufmann, M Desmulliez, Y Tian, D Price, M Hughes, N Strusevitch, C Bailey, C Liu, D Hutt, (2009) Megasonic agitation for enhanced electrodeposition of copper. Microsystem Technologies, 15 (8). pp. 1245-1254. 

H Lu, C Bailey, C Yin (2009), Design for reliability of power electronics modules, Microelectronic. Reliability, Vol. 49, pp 1250-1255. 

M Rizvi, H Lu, C Bailey, (2009), Modelling the Diffusion of Solid Copper into Liquid Solder Alloys, Thin Solid Films, Vol 517, pp 1686-1689 

S Stoyanov, C Bailey, M Desmulliez, (2009) Optimisation modelling for thermal fatigue reliability of lead-free interconnects in fine-pitch flip-chip packaging, Soldering and Surface Mount Technology, Vol 21, No. 1, pp 11-24 

M Alam, H Lu, C Bailey, Y Chan, (2009), Finite Element Simulation of Stress Intensity Factors in Solder Joint Intermetallic Compounds, IEEE Trans. on Device and Materials Reliability, Vol 9, No. 1, pp 40-48. 

M Rizvi, C Bailey, H Lu, (2008) Failure mechanisms of ACF joints under isothermal ageing, Microelectronics Reliability, vol. 39, no. 9, pp. 1101-1107 

M Rizvi, H Lu, C Bailey, Y Chan, M Lee, C Pang,(2008) "Role of bonding time and temperature on the physical properties of coupled anisotropic conductive-nonconductive adhesive film for flip chip on glass technology", Microelectronic engineering, vol. 85, pp238-244

K Sinclair, G Goussetis, M Desmulliez, A Sangster, T Tilford, C Bailey, A Parrott, (2008), Optimisation of an open ended microwave for microelectronics packaging, IEEE Transactions Microwave Theory and Techniques, Vol. 56, N.11, pp.2635-2641 

A. Richardson, C. Bailey, J.-M. Yanou, N. Dumas, D. Liu, S. Stoyanov, N. Strusevich, (2008) System in package technology - design for manufacture challenges, Emerald Circuit World, Vol. 33, No. 1, pp. 36-46

Browse our publications database

N Strusevich, C Bailey, S Costello, M Patel and M Desmulliez (2013), Numerical modeling of the electroplating process for microvia fabrication, 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), pp 1-6, DOI 10.1109/EuroSimE.2013.6529989

C Yin, C Best, C Bailey, S Stoyanov, M Alam (2012), Statistical analysis of the impacts of refinishing process on the reliability of microelectronic components, 13th International Conference on Electronic Technology and High Density Packaging (ICEPT-HDP), pp 1377-1381, DOI 10.1109/ICEPT-HDP.2012.6474862

E Kamara, H Lu, C Bailey, O Thomas, D Di Maio, C Hunt, I Fulton (2012), Inverse analysis of solder joint creep properties, 13th International Conference on Electronic Technology and High Density Packaging (ICEPT-HDP), pp 275-279, DOI 10.1109/ICEPT-HDP.2012.6474617 

S Stoyanov, C Best, C Yin, M Alam, C Bailey, P Tollafield (2012), Experimental and modelling study on the effects of refinishing lead-free microelectronic components, 4th International Conference on Electronic System-Integration Technology Conference (ESTC), pp 1-6, DOI: 10.1109/ESTC.2012.6542213 

C Bailey, X Zhu, H Lu, Y Chan (2012), Modelling metal migration for high reliability components when subjected to thermo-mechanical loading 14th International Conference on Electronics Packaging Technology Conference (EPTC), pp 474-478, DOI: 10.1109/EPTC.2012.6507130 

T Sutharssan, C Bailey, S Stoyanov (2012), A comparison study of the prognostics approaches to Light Emitting Diodes under accelerated aging, 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), pp 1-8, DOI: 10.1109/ESimE.2012.6191783 

A Kabir, C Bailey, H Lu, S Stoyanov (2012), A review of data-driven prognostics in power electronics, 35th International Spring Seminar on Electronic Technology (ISSE), pp189-192, DOI: 10.1109/ISSE.2012.6273136 

C Bailey (2012), Design, simulation and modelling for nanopackaging applications: current capabilities and future requirements, 12th IEEE Conference on Nanotechnology, pp 1-2, DOI: 10.1109/NANO.2012.6322238

Browse our publications database