Stoyan Stoyanov

Dr Stoyan Stoyanov

Stoyan Stoyanov

Dr Stoyan Stoyanov

Reader

Mathematical Sciences

Faculty of Architecture, Computing and Humanities

Stoyan Stoyanov joined the University in 1999.

Expertise and Collaborations

  1. Research interests and expertise in computational engineering (finite element analysis, CFD, multi-physics), Design-for-X for electronic products, design optimisation, robustness validation & engineering reliability
  2. Development and integration of numerical techniques for CAE in microelectronics, micro-systems, embedded devices, etc.
  3. Worked extensively on the award winning Cutty Sark project
  4. Collaborated with 20+ companies including Philips, BAE Systems, BOC, Photonics, TRW Automotive, Celestica, DEK, Cutty Sark Trust, GSK, etc and leading academic organisations (Cambridge, Nottingham, Loughborough, Heriot-Watt, Technical University of Dresden, City University Hong Kong, and others)

Qualifications

  1. NVQ Level 4 in Management, 09/2004-09/2006, CMI, Certified 02/2008
  2. PhD, University of Greenwich, Title: Optimisation Modelling for Microelectronics Product Design (2004)
  3. MSc in Applied Mathematics, Operational Research and Optimisation, Sofia University, Bulgaria (1996)

(1) Co-managing CMRG
(2) Support for project proposals and bids
(3) Member of the University of Greenwich Peer Review College since 2012
(4) Member of the review panel at the University of Greenwich for the RESEARCH AND ENTERPRISE INVESTMENT PROGRAMME

Course leader 2016/17

Reliability and Optimisation 

Selected publications

Over 60 conference and journal publications including four chapters in books.

1) Awarded Readership in 2010

2) Winner of the National Times Higher Education Award 2009 for Outstanding Engineering Research Team of the Year (October 2009)

3) Knowledge Base Collaboration Award, and the overall "champion" award, the Knowledge Transfer Collaboration of 2008, at the London Knowledge Transfer Awards run by London Development Agency (December 2008

4) The University of Greenwich 2008 Early Career Research Excellence Award

5) Best Partnership Award at the National Technology Strategy Board (TSB) 2008 KTP awards (March 2008)

6) Excellent Presentation Award at the 33rd International Spring Seminar on Electronics Technology for the paper "Reduced Order Modelling for Risk Mitigation in De3sign of Miniaturised/Integrated Products" (May 2010, Warsaw, Poland

7) A certificate for recognising significant contribution to organisation of IEEE 2nd International ESTC, from president of IEEE CPMT society (2008)

8) Best paper award at the Fourth IEEE International Symposium on Electronic Packaging Technology (ISEPT), Beijing, China, for the work entitled "A modelling and experimental analysis of the no-flow underfill process for flip-chip assembly"

Member of Institute of Electrical and Electronics Engineers (IEEE);

Member of Computational Intelligence Society;

Member of Components, Packaging, & Manufacturing Technology(CPMT) Society;

Member of the Steering Committee of the International Spring Seminar on Electronics Technology

Numerical modelling and simulation

Design optimisation

Robustness Validation

Engineering reliability

Statistical data analysis

Prognostics and Health Management

Funded research projects

Research Project: Technology Assessment on the Effects of Refinishing Lead-Free Microelectronic Components (DoD Funding)

Stage 1.5+ : 06/2012-03/2013

Stage 1.5 : 10/2011-04/2012

Stage 1.0 : 10/2010-09/2011

Partners: Micross Components Limited, Selex Galileo, Rolls Royce, General Dynamics, Cassidian, CMCA, Scimus Solutions, Senelac Ltd, and Unisem Europe

Description Stage 1.5+: Thermo-mechanical Modelling of the impact of Hot Solder Dip refinishing process, Laser de- and re-balling approach to refinishing BGA components, BGA thermo-mechanical response to reflow assembly process and behaviour of 1st level solder interconnects, reliability assessment for satellite application

Description Stage 1.5: Thermo-mechanical modelling and limited experimental assessment of the impact of refinishing leadless components (BGAs, QFNs) using Micross Components' double hot solder dip process. 

Description Stage 1.0: Modelling and experimental assessment of the impact of refinishing leaded components (QFP, SOP, etc) using using Micross Components' double hot solder dip process. The study of this post-manufacturing process aimed at assessing the potential risk of damage due to Hot Solder Dip (HSD)process. This process is one of the risk mitigation strategies to the tin whisker phenomenon that imposes serious risk of electronics components failure in high reliability applications.

, , , and () . In: Open Computer Sciences. De Gruyter Open. pp. 200-211.

, , and () . In: IEEE Transactions on Components, Packaging and Manufacturing Technology. IEEE. pp. 2210-2218. ISSN 2156-3950 ISSN 2156-3950

, , , and () . In: Journal of Intelligent Manufacturing. Springer US. pp. 1497-1514. ISSN 0956-5515 ISSN 0956-5515

, , , , , and () . In: Microelectronics Reliability. Elsevier Ltd.. pp. 109-117. ISSN 0026-2714 ISSN 0026-2714

, and () . In: Microelectronics Reliability. Elsevier. pp. 111-119. ISSN 0026-2714 ISSN 0026-2714

and () . In: Microelectronics Reliability. Elsevier. pp. 1271-1279. ISSN 0026-2714 ISSN 0026-2714

, , and () . In: Microelectronics Reliability. Elsevier Ltd.. pp. 424-431. ISSN 0026-2714 ISSN 0026-2714

, , and () . In: Ships and Offshore Structures. Taylor & Francis. pp. 643-654. ISSN 1744-5302 ISSN 1744-5302

, , , , , , , and () . In: Microelectronics Reliability. Elsevier Ltd.. pp. 1055-1067. ISSN 0026-2714 ISSN 0026-2714

, , and () . In: Journal of Electronic Packaging. American Society of Mechanical Engineers (ASME). ISSN 1528-9044 ISSN 1528-9044

, , and () . In: Micromachines. MDPI AG. pp. 78-100. ISSN 2072-666X ISSN 2072-666X

, , and () . In: Microelectronics Reliability. Elsevier Ltd.. pp. 936-945. ISSN 0026-2714 ISSN 0026-2714

, , , , , and () . In: IEEE Transactions on Reliability. Institute of Electrical and Electronics Engineers, Inc.. pp. 3-13. ISSN 0018-9529 ISSN 0018-9529

, , , , and () . In: Engineering Computations. Emerald Group Publishing Limited. pp. 93-111. ISSN 0264-4401 ISSN 0264-4401

, , , , , and () . In: International Journal of Performability Engineering. RAMS Consultants. pp. 499-512. ISSN 0973-1318 ISSN 0973-1318

, and () . In: Computers & Structures. Elsevier Ltd.. pp. 649-663. ISSN 0045-7949 ISSN 0045-7949

, , , , , and () . In: Journal of Physics: Conference Series (JPCS). In: 16 ISCMP: Progress in Solid State and Molecular Electronics, Ionics and Photonics. IOP Publishing Ltd., Bristol, UK. ISSN 1742-6588 ISSN 1742-6588

Browse our research at GALA

, , , , , and () . In: 2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010. IEEE Computer Society, Piscataway NJ. ISBN 9781424470266

, , , , , and () . In: Prognostics & Health Management Conference, 2010, PHM '10. IEEE. pp. 1-6. ISBN 978-1-4244-4756-5 (print), 978-1-4244-4758-9 (e-book)

Browse our research at GALA

, and () . In: Co-Design and Modelling for Advanced Integration and Packaging. World Scientific Publishing. ISSN 2315-473X ISBN 978-9814740203 ISSN 2315-473X

Browse our research at GALA

and () . In: Proceedings of the 2018 International Conference on Computing, Electronics & Communications Engineering (iCCECE). IEEE Xplore. pp. 59-64. ISBN 9781538649046

, and () . In: Proceedings of 41st Spring Seminar on Electronics Technology (ISSE). IEEE Xplore. pp. 1-6. ISBN 978-1-5386-5730-0

, and () . In: Proceedings EuroSimE 2018. IEEE Xplore. pp. 1-9. ISBN 978-1-5386-2358-9

, , and () . In: 2017 18th International Conference on Electronic Packaging Technology (ICEPT). IEEE. pp. 1021-1026. ISBN 978-1-5386-2973-4

and () . In: Proceedings 2017 40th International Spring Seminar on Electronics Technology (ISSE). IEEE. ISBN 978-1-5386-0583-7

, , and () . In: 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE. pp. 1-7. ISBN 978-1-5090-2106-2

, , and () . In: 3rd Fraunhofer Direct Digital Manufacturing Conference, DDMC 2016. Proceedings. Fraunhofer Verlag, Stuttgart. ISBN 978-3-8396-9128-1

, and () . In: Proceedings of the 2014 37th International Spring Seminar on Electronics Technology. Institute of Electrical and Electronics Engineers Inc., Piscataway, NJ, USA. pp. 44-49. ISBN 978-147994455-2

, , , and () . In: 20th International Workshop on Thermal Investigations of ICs and Systems. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 9781479954155

, and () . In: Proceedings of 36th International Spring Seminar on Electronics Technology, Alba Iulia, Romania, May 8-12, 2013, pp.1-8. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA. pp. 253-258. ISSN 2161-2528 ISBN 9781479900367 ISSN 2161-2528

, , and () . In: Historic Ships Conference 2012. Royal Institution of Naval Architects (RINA).

, , and () . In: 2012 35th International Spring Seminar on Electronics Technology. Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA. pp. 189-192. ISSN 2161-2528 ISBN 978-1-4673-2241-6 (Print), 978-1-4673-2239-3 (Online) ISSN 2161-2528

, , , , , and () . In: 2012 35th International Spring Seminar on Electronics Technology. Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA. pp. 303-308. ISSN 2161-2528 ISBN 978-1-4673-2241-6 (Print), 978-1-4673-2239-3 (Online) ISSN 2161-2528

, , , , , and () . In: 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2012). Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA. ISBN 978-1-4673-1512-8

, and () . In: 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. Institute of Electrical and Electronic Engineers, Inc, Piscataway, N.J., USA. ISBN 978-1-4673-1512-8

, , and () . In: Microelectronics and Packaging. Institute of Electrical and Electronic Engineers, Inc, Piscataway, NJ, USA. pp. 1-7. ISBN 978-1-4673-0694-2 (print)

, , , , and () . In: 2012 4th Electronic System-Integration Technology Conference (ESTC). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 9781467346450

, , and () . In: Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA. pp. 1-7. ISBN 978-1-4577-1770-3 (print), 978-1-4577-1768-0 (eISBN)

and () . In: Electronics Technology (ISSE), 2011 34th International Spring Seminar on. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. pp. 424-429. ISSN 2161-2528 ISBN 978-1-4577-2111-3 ISSN 2161-2528

, , , , and () . In: ISSE 2010 - 33rd International Spring Seminar on Electronics Technology: Polymer Electronics and Nanotechnologies: Towards System Integration - Conference Proceedings. IEEE Computer Society, Piscataway, USA. pp. 402-407. ISBN 9781424478491 (print), 9781424478507 (online)

, and () . In: EngOpt2010 2nd International Conference on Engineering Optimization. EngOpt2010. pp. 1-10.

Browse our research at GALA