Christopher Bailey

Professor Christopher Bailey BSc, MBA (Technology Management), PhD (Computational Modelling)

Faculty Director for Research and Enterprise

Professor Chris Bailey joined the University of Greenwich in 1993 as a senior lecturer and was promoted to Professor in 2001. He is currently Director of the Computational Mechanics and Reliability Group within the Faculty of Liberal Arts and Sciences, and he is also the Faculty Director for Research and Enterprise.

As a Research Professor, his specialisms include computational mechanics, finite element analysis, numerical optimisation, and multi-physics modelling. He is currently supervising PhD students in research related to design and mathematical modelling technologies for a diverse number of applications such as electronic systems, renewable energy, and heritage conservation.

Chris has a BSc (Hons) in Computing, Mathematics, and Statistics; an MBA in Technology Management; and a PhD in Computational Modelling. He previously worked as a Senior Research Fellow at Carnegie Mellon University (USA).

Responsibilities within the university

As Faculty Director for Research & Enterprise, Chris is responsible for overseeing the faculty research and enterprise strategy, development and delivery of the faculty REF and KEF submissions, and fostering a collaborative culture within the faculty for research and enterprise. As Faculty Director for Research and Enterprise, roles include the following:

  • Member of Faculty Senior Management Team
  • Member of the Faculty Board
  • Chair of the Faculty Research and Enterprise Committee
  • Member of the University Research and Enterprise Committee

In addition to the above, Chris is a Research Professor undertaking the following:

  • Managing the Computational Mechanics and Reliability Group
  • Applying for research and enterprise grants (£3M+ during 2014-2020)
  • Writing journal and conference papers (over 300 papers in total, and 80 during the period 2014-2020)
  • Supervising PhD students (total of 22 PhD students successfully supervised)

Awards

Honours and Awards

  • Number of best paper awards at international conferences (including IEEE ITHERM [2020], IMAPS EMPC [2019], Fraunhofer DDMC [2016], etc)
  • Visiting Professor: Indian Institute of Technology, Karaghpor, India, (2018)
  • Royal Society/Kan Tong Po Visiting Professorship to Hong Kong (2004 - 2005)
  • Best Knowledge Transfer Partnership Award for London (2008)
  • Times Higher Education Award for Outstanding UK Engineering Research Team of the year (2009)
  • Global Watch Mission to China (2004), Academic Member of Dti Funded Mission to Investigate R&D in China related to Optoelectronics.
  • Global Watch Mission to USA (2006), Academic Member of Dti Funded Mission to Investigate the latest techniques in Thermal Management of Electronic Systems

Recognition

External Posts

  • Member of the EPSRC Peer Review College
  • President, IEEE Electronics Packaging Society
  • Chair, UK & Ireland Electronic Packaging and Reliability Societies
  • Member, Executive Committee, EPSRC Centre for Power Electronics
  • External Examiner, Heriot-Watt University, MSc Smart Systems Integration
  • Reviewer, NWO, Dutch Funding Agency
  • Reviewer, RGC, Hong Kong Funding Agency
  • Reviewer, Grant Proposals, University of Cyprus
  • Expert Witness, Patent Litigation USA (2014-2016); UK (2020)
  • Chapter Chair, UK & Ireland Chapter, IEEE EPS and Reliability Societies
  • Chapter Lead, Modelling and Simulation, IEEE Heterogeneous Integration Roadmap

Editorial Boards and Journal Reviewer

  • Associate Editor, IEEE Transactions for Components, Packaging, and Manufacturing Technology
  • Associate Editor, Journal of Mechanics, Cambridge University Press
  • Reviewer, IEEE Transactions on Devices and Materials Reliability
  • Reviewer, IEEE Transactions on Power Electronics
  • Reviewer, International Journal for Numerical Methods in Engineering
  • Reviewer, International Journal for Numerical Methods in Fluids
  • Reviewer, Computers and Structures
  • Reviewer, Metallurgical Transactions
  • Reviewer, IEE Journal of Computing and Control Engineering

External PhD Examiner

Examined PhD’s at a number of universities both in the UK and Internationally, including the following: Brunel, Heriot-Watt, Oxford Brookes, Birmingham, Loughborough, Lancaster, Leeds, Sheffield, Imperial College, Nottingham, Liverpool John Moores, Technical University Delft (Netherlands), Chalmers University (Sweden), HKUST (Hong Kong), Tampere (Sweden)

Research / Scholarly interests

Chris’s research focuses on the development and use of virtual prototyping technologies (including design methodologies, mathematical modelling, finite element analysis, numerical optimisation, physics-of-failure approaches to reliability, and multi-physics modelling. Working with external partners worldwide (Industry, professional societies such as IEEE and IMAPS) his research outputs are being used to support a number of applications from electronic product design to offshore renewable energy to the conservation of heritage structures and artifacts. His research work has also contributed to industrial road-mapping, where he leads and supports chapters in the IEEE Heterogeneous Integration roadmap for Co-Design and Modelling and Simulation.

Recent key funded projects

  • High Reliability Interconnects: New Methodologies for Lead-Free Solders (P), Funded by EPSRC (EP/R019207), 2018-2021, £105,910
  • Mult-Domain Virtual Prototyping Techniques for Wide-Bandgap Power Electronics (C), Funded by EPSRC (EP/R004390), 2017-2021, £1,070,258
  • Underpinning Power Electronics 2012: Hub (C), Funded by EPSRC (EP/K035304), 2013-2020, £4,108,000
  • Underpinning Power Electronics 2012: Components Theme, (C), Funded by EPSRC (EP/K034804), 2013 – 2017, £1,976,000
  • Reliability Prediction Analysis for Solder Joint integrity (P), Funded by GDAIS (USA), 2014-2019, £750,000
  • An Innovative Electronics Manufacturing Research Centre, (C), Funded by EPSRC (EP/H03014X), 2010 – 2015, £9,088,809
  • Saving the Medway Queen, (P), Funded by Innovate-UK, KTP, 2012-2014, £60,000
  • NextFactory (C), Funded by the European Commission (FP7), 2012 – 2016, £350,000 Euros
  • PEMREL (P), Funded by the European Commission (FP7), 2010 – 2014, 200,00 Euros

Key funded projects

1. Lead-Free Processing of COTS components, (2013-2014), Funded by GDAIS (USA) ($170,000)This project is developing a modelling approach to predicting the reliability of COTS electronic components to ensure they are suitable for high reliability applications.

2. NextFactory (2013-2017), Funded by EU-FP7 350,000 eurosDevelopment of multi-physics models and condition monitoring software for 3D ink-jet printing of microsystem components.

3. EPSRC Underpinning Power Electronics (2013-2019)- HUB, Funded by EPSRC: 64,000 UK SterlingSupports Professor Bailey on the executive committee of this 18M initiative funded by the EPSRC,

4. EPSRC Underpinning Power Electronics - Components Theme (2013-2017), Funded by EPSRC: 450,000 UK SterlingSupports development of multi-physics models and development of reliability software such as PowerLife for next generation of power electronic components.

5. RODENT: Damage mechanics models for power electronic module reliability, funded by EPSRC/IeMRC (2012-2015): 210,000 UK Sterling Supports the development of damage mechanics models that will predict crack initiation and growth in electronic interconnects

6. Subsea Cables: Funded by SSE (2012-2014) : 144,000 UK SterlingDevelopment of models to predict reliability of subsea power cables. Also the development of software that embeds these models for use by SSE staff.

7. PEMREL: Reliability and Risk Analysis of Power Electronics Modules; Funded by EU Framework 7 (2011 - 2013) 200,000 euros Development of physics of failure models and the PowerLife software for power electronics modules.

8. COTS components for High Reliability Applications; Funded by GDAIS (USA) (2010 - 2013) US$250,000 Numerical analysis of the hot solder dipping process for refinishing electronic components that will be used in high reliability applications.

9. Thermal Management and Optical Interconnects for Defence Electronics (2011-2013); funded by MOD and DGA (France) 90,000 UK SterlingThermal modelling and reliability predictions of electronic components which are subjected to harsh defence environments.

10. FAMOBS; Frequency Agile Microwave Bonding System; Development of Multi-Physics Models for Microwave Bonding of Adhesives in Electronic Packaging; Funded by EU-FP7; (2008-2011) 250,000 UK Sterling Multi-physics modelling of a novel microwave heating process for use in manufacture of electronic packages.

11. Modelling of Power Modules, TSB funded project developing reliability models for Power Electronics Modules (2006-2009) - 220,000 UK SterlingDevelopment of reliability/robustness models for power electronics components. This was the start of the PowerLife software development.

12. Power Electronics Flagship, EPSRC/IeMRC funded project investigating the reliability of power electronics modules (2005-2010) - 184,000 UK SterlingPhysics of failure models for predicting behaviour of power electronic components.

13. Prognostics for Power Electronics Modules, EPSRC/IeMRC funded project investigating models for health monitoring of power electronic systems (2008-2010) - 122,000 UK Sterling Development of both model and data driven algorithms for maintaining power electronic components in the field in real time.

14. 3D-Mintegration; EPSRC Grand Challenge Project on Micro-Engineered Products (2006 - 2010); 400,000 UK Sterling Development of modelling techniques for 3D miniaturised components. This was and EPSRC Grand Challenge project.

15. Design for Manufacture of System in Package (SiP) Technologies; Funded by IeMRC (2007-2009); 120,000 UK Sterling Development of models for SiP packages in collaboration with Lancaster University, Selex and NXP.

16. ENDVIEW; Development of Multi-Physics Modelling Techniques for Liquid Crystal Displays with LED Backlights; Funded by TSB (2008-2010); 86,000 UK SterlingDevelopment of multi-physics models to predict the behaviour if ruggedized displays for use in the aerospace sector.

17. MEMSA; Modelling the Electro-deposition for Microsystems Applications; Funded by EPSRC (2006-2009); 180,000 UK Sterling Development of multi-physics models to predict the quality of the electroplating manufacturing process as used to fabricate Microsystems components.

18. Long-Life: Reliability of Semiconductor Devices; Funded by Prime Ministers Collaboration Initiative with Kyoto University, Japan (2009 - 2011); 40,000 UK

Sterling Funding provided to collaborate with Kyoto University (Japan) to investigate novel measurement and modelling techniques for predicting reliability of electronic components.

Recent publications

Article

Santhanakrishnan, Mani Sekara , Tilford, Timothy, Bailey, Christopher (2021), Multi-objective NSGA-II based shape optimisation of the cross-sectional shape of passively cooled heat sinks. Emerald. In: , , , . Emerald, International Journal of Numerical Methods for Heat and Fluid Flow ISSN: 0961-5539 (Print), (doi: ) NB Item availability restricted.

Tilford, Tim , Stoyanov, Stoyan, Braun, Jessica, Janhsen, Jan Christoph , Patel, Mayur K. , Bailey, Chris (2021), Comparative reliability of inkjet-printed electronics packaging. IEEE. In: , , , . IEEE, IEEE Transactions on Components, Packaging and Manufacturing Technology, 11 (2) . pp. 351-362 ISSN: 2156-3950 (Print), 2156-3985 (Online) (doi: https://doi.org/10.1109/TCPMT.2021.3049952).

Hinojosa Herrera, Ana , Walshaw, Chris, Bailey, Chris (2020), Failure mode & effect analysis and another methodology for improving data veracity and validity. International Association of Educators and Researchers (IAER). In: , , , . International Association of Educators and Researchers (IAER), Annals of Emerging Technologies in Computing (AETiC), 4 (3) . pp. 9-16 ISSN: 2516-0281 (Print), (doi: https://doi.org/10.33166/AETiC.2020.03.002).

Rajaguru, Pushpa , Lu, Hua, Bailey, Chris, Bella, Martina (2020), Modelling and analysis of vibration on power electronic module structure and application of model order reduction. Elsevier. In: , , , . Elsevier, Microelectronics Reliability, 110: 113697 ISSN: 0026-2714 (Print), (doi: https://doi.org/10.1016/j.microrel.2020.113697).

Stoyanov, Stoyan , Bailey, Christopher, Stewart, Paul, Parker, Mike , Roulston, John F. , Leonardo MW Ltd , Micross Components (2020), Experimental and modelling study on delamination risks for refinished electronic packages under hot solder dip loads. IEEE. In: , , , . IEEE, IEEE Transactions on Components, Packaging and Manufacturing Technology, 10 (3) . pp. 502-515 ISSN: 2156-3950 (Print), 2156-3985 (Online) (doi: https://doi.org/10.1109/TCPMT.2020.2972635).

Shahjalal, Mohammad , Rishad Ahmed, MD, Lu, Hua, Bailey, Chris , Forsyth, Andrew (2020), An analysis of the thermal interaction between components in power converter applications. IEEE. In: , , , . IEEE, IEEE Transactions on Power Electronics, 35 (9) . pp. 9082-9094 ISSN: 0885-8993 (Print), 1941-0107 (Online) (doi: https://doi.org/10.1109/TPEL.2020.2969350).

Ahsan, M. , Stoyanov, S., Bailey, C., Albarbar, A. (2020), Developing computational intelligence for smart qualification testing of electronic products. IEEE. In: , , , . IEEE, IEEE Access, 8 . pp. 16922-16933 2169-3536 (Online) (doi: https://doi.org/10.1109/ACCESS.2020.2967858).

Hinojosa Herrera, Ana Elsa , Stoyanov, Stoyan, Bailey, Christopher, Walshaw, Christopher , Yin, Chunyan (2019), Data analytics to reduce stop-on-fail test in electronics manufacturing. De Gruyter Open. In: , , , . De Gruyter Open, Open Computer Sciences, 9 (1) . pp. 200-211 2299-1093 (Online) (doi: https://doi.org/10.1515/comp-2019-0014).

Santhanakrishnan, Mani sekaran , Tilford, Tim, Bailey, Chris (2019), Multi-material heatsink design using level-set topology optimization. IEEE. In: , , , . IEEE, IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (8) . pp. 1504-1513 ISSN: 2156-3950 (Print), 2156-3985 (Online) (doi: https://doi.org/10.1109/TCPMT.2019.2929017).

Yin, Chunyan , Stoyanov, Stoyan, Bailey, Christopher, Stewart, Paul (2019), Thermo-mechanical analysis of conformally coated QFNs for high reliability applications. IEEE. In: , , , . IEEE, IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (11) . pp. 2210-2218 ISSN: 2156-3950 (Print), 2156-3985 (Online) (doi: https://doi.org/10.1109/TCPMT.2019.2925874).

Bailey, Christopher , Yin, Chunyan, Rajaguru, Pushparajah (2019), Predicting damage and life expectancy of subsea power cables in offshore renewable energy applications. IEEE. In: , , , . IEEE, IEEE ACCESS, 7 . pp. 54658-54669 2169-3536 (Online) (doi: https://doi.org/10.1109/ACCESS.2019.2911260).

Tonry, Catherine E. H. , Patel, Mayur K., Yu, Weixing, Desmulliez, Marc P. Y. , Bailey, Christopher (2019), Fabrication of hollow polymer microstructures using dielectric and capillary forces. Springer Berlin Heidelberg. In: , , , . Springer Berlin Heidelberg, Microsystem Technologies . pp. 1-8 ISSN: 0946-7076 (Print), 1432-1858 (Online) (doi: https://doi.org/10.1007/s00542-019-04409-z).

Stoyanov, Stoyan , Ahsan, Mominul, Bailey, Chris, Wotherspoon, Tracy , Hunt, Craig , Microchip Technology Inc. (2019), Predictive analytics methodology for smart qualification testing of electronic components. Springer US. In: , , , . Springer US, Journal of Intelligent Manufacturing, 30 (3) . pp. 1497-1514 ISSN: 0956-5515 (Print), 1572-8145 (Online) (doi: https://doi.org/10.1007/s10845-018-01462-9).

Rajaguru, Pushpa , Lu, Hua, Bailey, Chris (2019), Time integration damage model for Sn3.5Ag solder interconnect in power electronic module. IEEE. In: , , , . IEEE, IEEE Transactions on Device and Materials Reliability, 19 (1) ISSN: 1530-4388 (Print), 1558-2574 (Online) (doi: https://doi.org/10.1109/TDMR.2019.2891949).

Nwanoro, Kenneth C. , Lu, Hua, Yin, Chunyan, Bailey, Chris (2018), Using FloTHERM XT and ANSYS workbench to perform Thermo-Mechanical analysis. Mentor Graphics. In: , , , . Mentor Graphics, Engineering Edge (doi: ) NB Item availability restricted.

Blanche, Jamie , Flynn, David, Lewis, Helen, Couples, Gary , Buckman, Jim , Bailey, Chris , Tilford, Timothy (2018), Analysis of sandstone pore space fluid saturation and mineralogy variation via application of monostatic K-band frequency modulated continuous wave radar. IEEE. In: , , , . IEEE, IEEE Access, 6 . pp. 44376-44389 2169-3536 (Online) (doi: https://doi.org/10.1109/ACCESS.2018.2863024).

Desmulliez, Marc P.Y , Adamietz, Raphael, Pavuluri, Sumanth K., Tilford, Tim , Bailey, Chris , Schreier-Alt, Thomas , Warmuth, Jens (2018), Reliability testing and stress measurement of QFN packages encapsulated by an open-ended microwave curing system. Institute of Electrical and Electronics Engineers, Inc.. In: , , , . Institute of Electrical and Electronics Engineers, Inc., IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (1) . pp. 173-180 ISSN: 2156-3950 (Print), 2156-3985 (Online) (doi: https://doi.org/10.1109/TCPMT.2018.2859031).

Santhanakrishnan, Mani Sekaran , Tilford, Timothy, Bailey, Christopher (2018), Performance assessment of density and level-set topology optimisation methods for 3D heatsink design. SAGE Publications. In: , , , . SAGE Publications, Journal of Algorithms and Computational Technology, 12 (3) . pp. 273-287 ISSN: 1748-3018 (Print), 1748-3026 (Online) (doi: https://doi.org/10.1177/1748301818779019).

Nwanoro, Kenneth , Lu, Hua, Yin, Chunyan, Bailey, Chris (2018), An analysis of the reliability and design optimization of aluminium ribbon bonds in power electronics modules using computer simulation method. Elsevier. In: , , , . Elsevier, Microelectronics Reliability, 87 . pp. 1-14 ISSN: 0026-2714 (Print), (doi: https://doi.org/10.1016/j.microrel.2018.05.013).

Tilford, Tim , Stoyanov, Stoyan, Braun, Jessica, Janhsen, Jan Cristophe , Burgard, Matthias , Birch, Richard , Bailey, Chris , Fraunhofer Institute for Manufacturing Engineering and Automation IPA, Nobelstr. 12, Stuttgart, Germany , Microsemi Corporation, Castlegate Business Park, Caldicot, Monmouthshire, UK (2018), Design, manufacture and test for reliable 3D printed electronics packaging. Elsevier Ltd.. In: , , , . Elsevier Ltd., Microelectronics Reliability, 85 . pp. 109-117 ISSN: 0026-2714 (Print), (doi: https://doi.org/10.1016/j.microrel.2018.04.008).

Rajaguru, P. , Lu, H., Bailey, C., Castellazzi, A. , Pathirana, V. , Udugampola, N. , Udrea, F. (2018), Impact of underfill and other physical dimensions on Silicon Lateral IGBT package reliability using computer model with discrete and continuous design variables. Elsevier. In: , , , . Elsevier, Microelectronics Reliability, 83 . pp. 146-156 ISSN: 0026-2714 (Print), (doi: https://doi.org/10.1016/j.microrel.2018.02.024).

Lu, Hua and , Bailey, Christopher (2017), Failure and reliability analysis of a SiC power module based on stress comparison to a Si device. Institute of Electrical and Electronics Engineers (IEEE). In: , , , . Institute of Electrical and Electronics Engineers (IEEE), IEEE Transactions on Device and Materials Reliability, 17 (4) . pp. 727-737 ISSN: 1530-4388 (Print), (doi: https://doi.org/10.1109/TDMR.2017.2766692).

Rajaguru, Pushparajah , Ortiz-Gonzalez, Jose Angel, Lu, Hua, Bailey, Chris , Alatise, Olawiwola (2017), A multiphysics modeling and experimental analysis of pressure contacts in power electronics applications. Institute of Electrical and Electronics Engineers (IEEE). In: , , , . Institute of Electrical and Electronics Engineers (IEEE), IEEE Transactions on Components, Packaging and Manufacturing Technology, 7 (6) . pp. 893-900 ISSN: 2156-3950 (Print), 2156-3985 (Online) (doi: https://doi.org/10.1109/TCPMT.2017.2688021).

Ortiz Gonzalez, Jose , Alatise, Olayiwola, Aliyu, Attahir, Rajaguru, Pushparajah , Castellazzi, Alberto , Ran, Li , Mawby, Philip , Bailey, Chris (2017), Evaluation of SiC Schottky diodes using pressure contacts. Institute of Electrical and Electronics Engineers (IEEE). In: , , , . Institute of Electrical and Electronics Engineers (IEEE), IEEE Transactions on Industrial Electronics, 64 (10) . pp. 8213 -8223 ISSN: 0278-0046 (Print), 1557-9948 (Online) (doi: https://doi.org/10.1109/TIE.2017.2677348).

Rajaguru, P. , Lu, H., Bailey, C., Ortiz-Gonzalez, J. , Alatise, O. (2016), Evaluation of the impact of the physical dimensions and material of the semiconductor chip on the reliability of Sn3.5Ag solder interconnect in power electronic module: A finite element analysis perspective. Elsevier. In: , , , . Elsevier, Microelectronics Reliability, 68 . pp. 77-85 ISSN: 0026-2714 (Print), (doi: https://doi.org/10.1016/j.microrel.2016.12.002).

Stoyanov, Stoyan , Bailey, Chris, Tourloukis, Georgios (2016), Similarity approach for reducing qualification tests of electronic components. Elsevier. In: , , , . Elsevier, Microelectronics Reliability, 67 . pp. 111-119 ISSN: 0026-2714 (Print), (doi: https://doi.org/10.1016/j.microrel.2016.10.017).

Jones, Thomas D.A. , Flynn, David, Desmulliez, Marc P.Y., Price, Dennis , Beadel, Matthew , Strusevich, Nadia , Patel, Mayur , Bailey, Chris , Costello, Suzanne (2016), Morphology and acoustic artefacts of copper deposits electroplated using megasonic assisted agitation. Emerald. In: , , , . Emerald, Circuit World, 42 (3) . pp. 127-140 ISSN: 0305-6120 (Print), (doi: https://doi.org/10.1108/CW-03-2016-0006).

Rajaguru, Pushparajah , Lu, Hua, Bailey, Christopher (2015), A time dependent damage indicator model for Sn3.5Ag solder layer in power electronic module. Elsevier Ltd.. In: , , , . Elsevier Ltd., Microelectronics Reliability, 55 (11) . pp. 2371-2381 ISSN: 0026-2714 (Print), (doi: https://doi.org//10.1016/j.microrel.2015.07.047).

Stoyanov, S. and , Bailey, C. (2015), Modelling the impact of refinishing processes on COTS components for use in aerospace applications. Elsevier. In: , , , . Elsevier, Microelectronics Reliability, 55 (9-10) . pp. 1271-1279 ISSN: 0026-2714 (Print), (doi: https://dx.doi.org/10.1016/j.microrel.2015.07.030).

Rajaguru, Pushparajah , Lu, Hua, Bailey, Chris (2015), Sintered silver finite element modelling and reliability based design optimisation in power electronic module. Elsevier Ltd.. In: , , , . Elsevier Ltd., Microelectronics Reliability, 55 (6) . pp. 919-930 ISSN: 0026-2714 (Print), (doi: http://doi.org/10.1016/j.microrel.2015.03.011) NB Item availability restricted.

Yin, Chunyan , Best, Chris, Bailey, Chris, Stoyanov, Stoyan (2015), Statistical analysis of the impact of refinishing process on leaded components. Elsevier Ltd.. In: , , , . Elsevier Ltd., Microelectronics Reliability, 55 (2) . pp. 424-431 ISSN: 0026-2714 (Print), (doi: https://doi.org/10.1016/j.microrel.2014.11.001) NB Item availability restricted.

Rajaguru, Pushparajah , Mason, Peter, Bailey, Chris, Stoyanov, Stoyan (2014), Buckling analysis on the hull of the historic paddle steamer ‘Medway Queen’. Taylor & Francis. In: , , , . Taylor & Francis, Ships and Offshore Structures, 9 (6) . pp. 643-654 ISSN: 1744-5302 (Print), 1754-212X (Online) (doi: http://dx.doi.org/10.1080/17445302.2013.849065).

Musallam, Mahera , Yin, Chunyan, Bailey, Christopher, Johnson, Mark (2014), Mission profile-based reliability design and real-time life consumption estimation in power electronics. Institute of Electrical and Electronics Engineers, Inc.. In: , , , . Institute of Electrical and Electronics Engineers, Inc., IEEE Transactions on Power Electronics, 30 (5) . pp. 2601-2613 ISSN: 0885-8993 (Print), 1941-0107 (Online) (doi: http://dx.doi.org/10.1109/TPEL.2014.2358555).

Zhu, X. , Kotadia, H., Xu, S., Lu, H. , Mannan, S. H. , Bailey, C. , Chan, Y. C. (2014), Electromigration in Sn-Ag solder thin films under high current density. Elsevier B.V.. In: , , , . Elsevier B.V., Thin Solid Films, 565 . pp. 193-201 ISSN: 0040-6090 (Print), (doi: https://doi.org/10.1016/j.tsf.2014.06.030).

Rajaguru, Pushparajah , Lu, Hua, Bailey, Christopher (2014), Application of nonlinear fatigue damage models in power electronic module wirebond structure under various amplitude loadings. Shanghai University. In: , , , . Shanghai University, Advances in Manufacturing, 2 (3) . pp. 239-250 ISSN: 2095-3127 (Print), 2195-3597 (Online) (doi: https://doi.org/10.1007/s40436-014-0054-5).

Strusevich, Nadezhda , Desmulliez, Marc P.Y., Abraham, Eitan, Flynn, David , Jones, Thomas , Patel, Mayur , Bailey, Christopher (2013), Electroplating for high aspect ratio vias in PCB manufacturing: enhancement capabilities of acoustic streaming. Springer Berlin Heidelberg. In: , , , . Springer Berlin Heidelberg, Advances in Manufacturing, 1 (3) . pp. 211-217 ISSN: 2095-3127 (Print), 2195-3597 (Online) (doi: http://dx.doi.org/10.1007/s40436-013-0039-9).

Yin, C.Y. , Lu, H., Bailey, C., Chan, Y.C. (2013), Effects of moisture absorption on anisotropic conductive films interconnection for flip chip on flex applications. Elsevier B.V.. In: , , , . Elsevier B.V., Microelectronic Engineering, 107 . pp. 17-22 ISSN: 0167-9317 (Print), (doi: http://dx.doi.org/10.1016/j.mee.2013.02.070).

Stoyanov, Stoyan , Bailey, Chris, Alam, M.O., Yin, Chunyan , Best, Chris , Tollafield, Peter , Crawford, Rob , Parker, Mike , Scott, Jim (2013), Modelling methodology for thermal analysis of hot solder dip process. Elsevier Ltd.. In: , , , . Elsevier Ltd., Microelectronics Reliability, 53 (8) . pp. 1055-1067 ISSN: 0026-2714 (Print), (doi: http://dx.doi.org/10.1016/j.microrel.2013.02.018).

Li, H. , Yu, W., Zhang, L., Liu, Z. , Brown, K.E. , Abraham, E. , Cargill, S. , Tonry, C. , Patel, M.K. , Bailey, C. (2013), Simulation and modelling of sub-30 nm polymeric channels fabricated by electrostatic induced lithography. Royal Society of Chemistry. In: , , , . Royal Society of Chemistry, RSC Advances, 3 (29) . pp. 11839-11845 ISSN: 2046-2069 (Print), (doi: http://dx.doi.org/10.1039/c3ra40188j).

Rajaguru, Pushparajah , Stoyanov, Stoyan, Lu, Hua, Bailey, Christopher (2013), Application of Kriging and radial basis function for reliability optimization in power modules. American Society of Mechanical Engineers (ASME). In: , , , . American Society of Mechanical Engineers (ASME), Journal of Electronic Packaging, 135: 21009 (2) ISSN: 1528-9044 (Print), 1043-7398 (Online) (doi: http://dx.doi.org/10.1115/1.4024056).

Tonry, Catherine , Patel, Mayur K., Bailey, Christopher, Desmuliez, Marc P.Y. , Cargill, Scott , Yu, Weixing (2013), A method for the micro-encapsulation of dielectric fluids in joined polymer shells. Bentham Science Publishers. In: , , , . Bentham Science Publishers, Current Organic Chemistry, 17 (1) . pp. 65-71 ISSN: 1385-2728 (Print), 1875-5348 (Online) (doi: http://www.ingentaconnect.com/content/ben/coc/2013/00000017/00000001/art00011).

Zhu, Xiao , Kotadia, Hiren, Xu, Sha, Lu, Hua , Mannan, Samjid , Bailey, Chris , Chan, Yancheong (2013), Modelling electromigration for microelectronics design. The Japan Society of Mechanical Engineers. In: , , , . The Japan Society of Mechanical Engineers, Journal of Computational Science and Technology, 7 (2) . pp. 251-264 ISSN: 1881-6894 (Print), (doi: http://dx.doi.org/10.1299/jcst.7.251).

Book

Bailey, Christopher , Stoyanov, Stoyan, Lu, Hua (2017), Co-design And Modelling For Advanced Integration And Packaging: Manufacturing And Reliability. World Scientific Publishing. In: , , , Co-Design and Modelling for Advanced Integration and Packagin. World Scientific Publishing, . ISBN: 9789814740203ISSN: 2315-473X (Print), (doi: https://doi.org/10.1142/9900).

Book section

Flynn, David , Bailey, Christopher, Rajaguru, Pushpa, Wenshuo, Tang , Yin, Chunyan (2019), Prognostics and health management of subsea cables. Wiley-Blackwell. In: , , In: Douglas Goodman, James P. Hofmeister, Ferenc Szidarovszky (eds.), Prognostics and Health Management: A Practical Approach to Improving System Reliability Using Condition-Based Dat. Wiley-Blackwell, . ISBN: 9781119356653 (doi: ) NB Item availability restricted.

Conference item

Santhakrishnan, M. , Tilford, T., Bailey, C. (2016), On the Application of Topology Optimisation Techniques to Thermal Management of Microelectronics Systems. In: IEEE EuroSimE conference, 17-20 April, 2016, Montpellier, France , . , (doi: ).

Conference proceedings

Hinojosa Herrera, Ana Elsa , Walshaw, Chris, Bailey, Chris (2020), Improving Black Box Classification Model Veracity for Electronics Anomaly Detection. IEEE. In: , , , 2020 15th IEEE Conference on Industrial Electronics and Applications (ICIEA. IEEE, . pp. 1092-1097 . ISBN: 9781728151694ISSN: 2156-2318 (Print), 2158-2297 (Online) (doi: https://doi.org/10.1109/ICIEA48937.2020.9248258) NB Item availability restricted.

Stoyanov, Stoyan , Bailey, Christopher, Waite, Rhys, Hicks, Christopher , Golding, Terry , Microchip Technology Inc (Microsemi) , Amethyst Research Inc (2020), Packaging challenges and reliability performance of compound semiconductor focal plane arrays. IEEE. In: , , , 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC. IEEE, . pp. 1-8 . ISBN: 9780956808660 (doi: https://doi.org/10.23919/EMPC44848.2019.8951842).

Hinojosa Herrera, Ana Elsa , Walshaw, Chris, Bailey, Chris, Yin, Chunyan (2019), Failure mode & effect analysis for improving data veracity and validity. IEEE. In: , , In: Mahdi H. Miraz, Peter S. Excell, Andrew Ware, Safeeullah Soomro, Maaruf Ali (eds.), Proceedings of the IEEE International Conference on Computing, Electronics & Communications Engineering 2019 (IEEE iCCECE '19. IEEE, . pp. 100-105 . ISBN: 9781728121383 (doi: https://doi.org/10.1109/iCCECE46942.2019.8941849).

Rajaguru, Pushparajah , Santhanakrishnan, Manisekaran, Tilford, Tim, Bailey, Chris (2019), Design of additively manufactured heatsinks for power electronics thermal management using adjoint level-set topology optimization. IEEE. In: , , , 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC. IEEE, . ISBN: 9781728120782ISSN: 2474-1515 (Print), 2474-1523 (Online) (doi: https://doi.org/10.1109/THERMINIC.2019.8923530).

Nwanoro, Kenneth Chimezie , Lu, Hua, Yin, Chunyan, Bailey, Christopher (2018), Numerical simulation of the junction temperature, the coolant flow rate and the reliability of an IGBT module. IEEE. In: , , , 2018 24th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC 2018. IEEE, . pp. 250-255 . ISBN: 9781538667606 (doi: http://www.proceedings.com/42651.html) NB Item availability restricted.