Stoyan Stoyanov

Professor Stoyan Stoyanov BSc, MSc, PhD

Professor in Computational Engineering and Optimisation

Professor Stoyan Stoyanov is Reader in Computational Engineering and Head of the Computational Mechanics and Reliability Group (CMRG) at the School of Computing and Mathematical Sciences. He received his MSc degree in applied mathematics from Sofia University and obtained a PhD degree in computational engineering at the University of Greenwich in 2004. He holds NVQ Level 4 in Management from the Chartered Management Institute (2008) and became a Fellow of the Higher Education Academy (FHEA) in 2017.

Stoyan’s research interests and expertise are in the development and application of modelling and simulation technologies for numerical analysis of the performance and thermo-mechanical reliability of electronic products and microsystems, computational mechanics, physics-of-failure modelling, manufacturing and assembly process simulation, prognostics modelling, design optimisation, and computational intelligence.

Over the past 20 years, he worked on research and knowledge exchange projects with a focus on microelectronics design and advanced electronics packaging, electronics manufacturing, component assembly optimisation, quality and reliability assessment of electronics deployed in high-reliability and power applications, and industrial data analytics. Stoyan has collaborated with many national and international academic and industrial partners such as Leonardo Electronics, Microchip Technology, Hanwha-Phasor and Rolls Royce.

Posts Held Previously

  • 2007-2010, Senior Research Fellow, University of Greenwich
  • 2004-2007, Research Associate (KTP),  University of Greenwich
  • 2002-2004, Research Fellow, University of Greenwich

Engineering

Awards

Selected Awards

  • IEEE Electronics Packaging Society “Achievement Certificate” (2021)
  • Best paper awards at international conferences
    • IEEE EuroSIME conference, Malta (2022)
    • IEEE ITHERM conference, USA (2020)
    • IEEE EMPC conference, Italy (2019)
    • Fraunhofer Direct Digital Manufacturing Conference, Germany (2016)
  • Winner of the National Times Higher Education Award for Outstanding Engineering Research Team of the Year (2009)
  • Knowledge Transfer Collaboration award, London Development Agency (2008)
  • The University of Greenwich 2008 Early Career Research Excellence Award
  • Best Partnership Award for KTP, Technology Strategy Board (Innovate UK) (2008)
  • IEEE CPMT (EPS) society certificate for significant contribution to the organisation of the 2nd IEEE ESTC conference (2008)

Recognition
  • Senior Member of the Institute of Electrical and Electronics Engineers (IEEE)
  • Fellow of the Higher Education Academy (FHEA)
  • Member of IEEE Electronics Packaging Society (EPS)
  • Member of the Steering Committee of the IEEE International Spring Seminar on Electronics Technology (ISSE)
  • Member of the technical committees of IEEE International conferences: ESTC, ISSE, EMPC and EuroSIME
  • Invited Lecturer on Erasmus-Mundus MSc in Smart System Integration at Heriot-Watt University (Edinburgh), HSN University College of Southeast Norway and Budapest University of Technology and Economics in Hungary (BME)
  • Reviewer for the IEEE Trans. CPMT, MDPI Energies, Journal of Intelligent Manufacturing (Elsevier), IEEE-EPS conferences, and others.

Research / Scholarly interests

Main Research Areas

  • Computational Engineering
    • Virtual prototyping: development & application of computational models for numerical analysis and prediction of the performance of manufacturing processes, materials, and engineering products
    • Finite element analysis and physics-of-failure modelling; Reliability engineering
    • Numerical optimisation, Prognostics and Health Management (PHM)
  • Computational Intelligence and Data Analytics
    • Predictive analytics and machine learning, Deep Learning, and Data-driven modelling.

Current and New Research Projects

  • VP-PEM: Real-time Virtual Prototypes for the Power Electronics Supply Chain Modules
    • Co-I (UoG PI), EPSRC (EP/W006642/1), 07/23-06/26
    • Partners: University of Nottingham (lead) and four industrial partners.
  • MIRELAI: Microelectronics Reliability driven by Artificial Intelligence (EU Horizon-MSCA-DN)
    • UoG PI, Work-package Lead and Lead Supervisor of the UoG Doctorate Project
      Funded through UKRI (EPSRC, EP/X030148/1), 10/22-09/26
    • Partners: 21 organisations (TU-Delft, IMEC, Bosch, Siemens, etc.) from 7 European countries.
  • DAAP-PEM: Closed Loop Digitalised Data Analytics and Analysis Platform for Power Modules
    • PI & Project Lead, EPSRC (EP/W006642/1), 04/22-09/24
    • Partners: University of York and University of Liverpool, and Dynex Semiconductors.
  • PHASOR: Model-based Assessment of the Thermal Fatigue Performance of ASIC Variants
    • PI, Hanwha-Phasor (industry) funding.

Past Projects

  • Going Global India - Exploratory Grant
    • Co-I, British Council funding (IND/CONT/G/21-22/35), 2022
    • Partners: Indian Institute of Technology (IIT) Kharagpur and Jadavpur University, India
  • AI-enabled Modelling of Layered Composites
    • PI, UoG internal funding (Proof-of-Concept), 2020-2021
  • Multi-scale micromechanics modelling of SAC305 solders:
    • UoG Co-I, EPSRC funding (EP/R019207), 2018-2021
    • Partners: Imperial College London, Ford Motor Co, Nihon Superior, Rolls-Royce Plc (UK)
  • Reliability Prediction Analysis for Solder Joint integrity
    • Co-PI, GDAIS & DMEA (USA) and Leonardo-UK (industry) funding (HQ727-16-D-0003), 2013-2018
  • THEIA (Technically high element alignment for Focal Plane Arrays):
    • UoG Co-I, Innovate-UK funding (84066-518163), 2017-2018
    • Partners: Microchip Technology and Amethyst Research
  • Next Factory (3D Printing of Electronics)
    • UoG Co-I, FP7 EU funding (ID 608985), 2014-2017
    • Partners: IPA Fraunhofer, Uni Technologies, Microsemi, Acreo, and others
  • Technology Assessment on the Effects of Refinishing Lead-Free Microelectronic Components
    • Co-I, DMEA (Department of Defence, USA) funding (H94003-04-D-003-0056), 2010-2014
    • Partners: Selex ES, Rolls Royce, Airbus Defence and Space, Micross Components

PhD Student Supervision

Research topics of supervised PhD programmes include:

  • Microelectronics reliability driven by AI
  • Model order reduction for reliability predictions of electronic components
  • Predicting Degradation of Lithium-Ion Battery with Physics-Informed Machine Learning
  • Computational Data Analysis and Prognostics for Smart Testing of Electronic Products
  • Mathematical Modelling and Condition Based Monitoring of 3D Inkjet Printing Process
  • Diagnostic and Prognostic Tools for Monitoring Degradation in Aged Structures

Selected Consultancy Projects

  • Modelling the impact of embedding Cu coin into PCB on component reliability, funded by Leonardo, UK (2019)
  • FEA of BGA package, funded by Tessera, USA (2015)
  • Solder Interconnection Reliability Study, funded by GE Aviation, UK (2015)
  • Printed Circuit Board Analysis of CBGA, funded by Cassidian Electronics, Germany (2013)

Teaching

Lecturer on UoG MSc programmes (2006-2018)

  • MSc Applicable Mathematics, CMS, 2012-2018, Module MATH-1130, Reliability and Optimisation
  • MSc Applied Mathematical Modelling and Scientific Computing, CMS, 2006-2012, Module MATH-1081, Reliability and Risk Analysis in Design

Recent publications