Tim Tilford

Dr Tim Tilford B.Eng. M.Sc. PhD

Senior Lecturer in Computational Mechanics

Tim Tilford was awarded a Bachelor of Engineering degree in Aeronautical Engineering from Queen Mary College, London in 1998 and a Master of Science degree in Computational Fluid Dynamics from the University of Greenwich in 1999. He was awarded a PhD in Eulerian-Lagrangian Multidomain methods for multiphysics simulations in 2013. He was a Research Fellow in Computational Electromagnetics and Fluid Dynamics 2002–2013, a Lecturer in Computational Mechanics 2013-2014 and has been a Senior Lecturer in Computational Mechanics since 2014.

He has worked on a large number of projects including the EPSRC funded Power Electronics Flagship project, and the EPSRC/EU funded FAMOBS projects, the EU NextFactory project and is currently working on an EPSRC Power Electronics project.


B.Eng Aeronautical Engineering (Queen Mary College, University of London)
M.Sc by Research (University of Greenwich)
PhD. Computational Mechanics (University of Greenwich)

Responsibilities within the university

  • Senior Lecturer in Computational Mechanics
  • Researcher focusing on numerical analysis of complex coupled problems


Winner of best paper award at DDMC Additive manufacturing conference, Berlin, Germany in 2016


Fellow of the Institute of Mathematics and its Applications,

Chartered Scientist

Chartered Mathematician

Associate Editor, Journal of Algorithms and Computational Technology

Research / Scholarly interests

Dr Tilford is primarily focused on using numerical analysis to tackle challenges faced by UK and International engineering companies, particularly in the field of the reliability of electronics systems. He develops and utilises numerical techniques to evaluate and optimise the design of systems and manufacturing processes to improve the reliability and robustness of manufactured products. This is of critical relevance in the electronics field as the rate of progression in technologies means that evaluation of the lifetime of a commercial product is typically based on a prediction as opposed to historical data. Most recently he has been working on evaluating the reliability of additively manufactured electronics systems, aiding transition of the technology into a major multinational microelectronics company, and into assessment of Power Electronics systems utilising wide bandgap semiconductor materials which will underpin the transition to a low/zero carbon economy.

Key funded projects

NextFactory (2013-2017), Funded by EU-FP7 350,000 euros. Development of multi-physics models and condition monitoring software for 3D ink-jet printing of microsystem components.

FAMOBS; Frequency Agile Microwave Bonding System; Development of Multi-Physics Models for Microwave Bonding of Adhesives in Electronic Packaging; Funded by EU-FP7; (2008-2011) 250,000 UK Sterling. Multi-physics modelling of a novel microwave heating process for use in manufacture of electronic packages.

Recent publications


Santhanakrishnan, Mani Sekaran , Tilford, Timothy, Bailey, Christopher (2022), Heat transfer characteristics of plate fin heat sink with longitudinal vortex generators. Emerald. In: , , , . Emerald, International Journal of Numerical Methods for Heat and Fluid Flow ISSN: 0961-5539 (Print), (doi: https://doi.org/10.1108/HFF-06-2022-0386).

Santhanakrishnan, Mani Sekara , Tilford, Tim, Bailey, Chris (2021), Multi-objective NSGA-II based shape optimisation of the cross-sectional shape of passively cooled heat sinks. Emerald. In: , , , . Emerald, International Journal of Numerical Methods for Heat and Fluid Flow, 32 (3) . pp. 1025-1045 ISSN: 0961-5539 (Print), (doi: https://doi.org/10.1108/HFF-10-2020-0656).

Tilford, Tim , Stoyanov, Stoyan, Braun, Jessica, Janhsen, Jan Christoph , Patel, Mayur K. , Bailey, Chris (2021), Comparative reliability of inkjet-printed electronics packaging. IEEE. In: , , , . IEEE, IEEE Transactions on Components, Packaging and Manufacturing Technology, 11 (2) . pp. 351-362 ISSN: 2156-3950 (Print), 2156-3985 (Online) (doi: https://doi.org/10.1109/TCPMT.2021.3049952).

Santhanakrishnan, Mani sekaran , Tilford, Tim, Bailey, Chris (2019), Multi-material heatsink design using level-set topology optimization. IEEE. In: , , , . IEEE, IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (8) . pp. 1504-1513 ISSN: 2156-3950 (Print), 2156-3985 (Online) (doi: https://doi.org/10.1109/TCPMT.2019.2929017).

Blanche, Jamie , Flynn, David, Lewis, Helen, Couples, Gary , Buckman, Jim , Bailey, Chris , Tilford, Timothy (2018), Analysis of sandstone pore space fluid saturation and mineralogy variation via application of monostatic K-band frequency modulated continuous wave radar. IEEE. In: , , , . IEEE, IEEE Access, 6 . pp. 44376-44389 2169-3536 (Online) (doi: https://doi.org/10.1109/ACCESS.2018.2863024).

Desmulliez, Marc P.Y , Adamietz, Raphael, Pavuluri, Sumanth K., Tilford, Tim , Bailey, Chris , Schreier-Alt, Thomas , Warmuth, Jens (2018), Reliability testing and stress measurement of QFN packages encapsulated by an open-ended microwave curing system. Institute of Electrical and Electronics Engineers, Inc.. In: , , , . Institute of Electrical and Electronics Engineers, Inc., IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (1) . pp. 173-180 ISSN: 2156-3950 (Print), 2156-3985 (Online) (doi: https://doi.org/10.1109/TCPMT.2018.2859031).

Santhanakrishnan, Mani Sekaran , Tilford, Timothy, Bailey, Christopher (2018), Performance assessment of density and level-set topology optimisation methods for 3D heatsink design. SAGE Publications. In: , , , . SAGE Publications, Journal of Algorithms and Computational Technology, 12 (3) . pp. 273-287 ISSN: 1748-3018 (Print), 1748-3026 (Online) (doi: https://doi.org/10.1177/1748301818779019).

Tilford, Tim , Stoyanov, Stoyan, Braun, Jessica, Janhsen, Jan Cristophe , Burgard, Matthias , Birch, Richard , Bailey, Chris , Fraunhofer Institute for Manufacturing Engineering and Automation IPA, Nobelstr. 12, Stuttgart, Germany , Microsemi Corporation, Castlegate Business Park, Caldicot, Monmouthshire, UK (2018), Design, manufacture and test for reliable 3D printed electronics packaging. Elsevier Ltd.. In: , , , . Elsevier Ltd., Microelectronics Reliability, 85 . pp. 109-117 ISSN: 0026-2714 (Print), (doi: https://doi.org/10.1016/j.microrel.2018.04.008).

Conference item

Santhakrishnan, M. , Tilford, T., Bailey, C. (2016), On the Application of Topology Optimisation Techniques to Thermal Management of Microelectronics Systems. In: IEEE EuroSimE conference, 17-20 April, 2016, Montpellier, France , . , (doi: ).

Conference proceedings

Rajaguru, Pushparajah , Santhanakrishnan, Manisekaran, Tilford, Tim, Bailey, Chris (2019), Design of additively manufactured heatsinks for power electronics thermal management using adjoint level-set topology optimization. IEEE. In: , , , 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). IEEE, . ISBN: 9781728120782ISSN: 2474-1515 (Print), 2474-1523 (Online) (doi: https://doi.org/10.1109/THERMINIC.2019.8923530).

Tilford, T. , Bruan, J., Janhsen, J. C., Burgard, M. , Bailey, C. , Fraunhofer-Institut für Produktionstechnik und Automatisierung, Germany (2018), SPH analysis of inkjet droplet impact dynamics. WCCM. In: , , , Proceedings of the 13th World Congress on Computational Mechanics (WCCM XIII) and 2nd Pan American Congress on Computational Mechanics (PANACM II). WCCM, (doi: ).

Tilford, T. , Stoyanov, S., Tourloukis, G., Bailey, C. (2016), Numerical analysis of droplet deposition in inkjet printed electronics assembly. IEEE. In: , , , 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE, . pp. 1-7 . ISBN: 9781509021062 (doi: https:// doi.org/10.1109/EuroSimE.2016.7463358).