At the recently held ITHERM 2020 – the Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems – the Computational Mechanics and Reliability Group (CMRG) at the School of Computing and Mathematical Sciences has received Best Paper Award for their work entitled "Modelling Indium Interconnects for Ultra Fine-Pitch Focal Plane Arrays".
https://www.ieee-itherm.net/itherm/conference/best-paper-awards
Sponsored by the IEEE's Electronics Packaging Society (EPS), ITHERM is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems. It is regraded as the North America's premier conference in this field, providing top quality coverage of technological advances and innovation in the area.
The paper by the University of Greenwich team is an output from the collaborative research project THEIA, funded by Innovate UK, between University of Greenwich, Microchip Technologies Inc. and Amethyst Research. The project focused on the development of advanced packaging capabilities and associated design and modelling toolsets that can enable high quality and high reliability assembly of compound semiconductor infrared detector chips featuring high resolution pixel arrays.
