Group Lead
Stoyan Stoyanov
Professor in Computational Engineering and Optimisation
The Computational Mechanics and Reliability Group (CMRG) has research interests in the development and application of computer models for multi-physics/multi-scale predictions, numerical optimisation, physics-of-failure analysis, reliability and quality assessments, and maintenance of engineering structures. The group is also active in research on industrial data analytics and computational intelligence technologies. A particular focus of its modelling research is applied to microelectronics manufacturing and test, and to electronic components and microsystems. Under the direction of Dr Stoyan Stoyanov, the group is one of the main contributors to the Centre for Advanced Simulation and Modelling (CASM).
Publications
As a research team we publish in high ranking journals and present our work at international conferences. Since 2004 the group has authors over 300 papers. Further details on our publication can be found on GALA.
Recent publications
Article
Stoyanov, Stoyan , Bailey, Chris, Microchip Technology Inc., Amethyst Research (2023), Modeling Insights into the assembly challenges of focal plane arrays. IEEE. In: , , , . IEEE, IEEE Access . pp. 35207-35219 2169-3536 (Online) (doi: https://doi.org/10.1109/ACCESS.2023.3264806).
Santhanakrishnan, Mani Sekaran , Tilford, Timothy, Bailey, Christopher (2022), Heat transfer characteristics of plate fin heat sink with longitudinal vortex generators. Emerald. In: , , , . Emerald, International Journal of Numerical Methods for Heat and Fluid Flow, 33 (3) . pp. 1203-1228 ISSN: 0961-5539 (Print), (doi: https://doi.org/10.1108/HFF-06-2022-0386).
Xu, Yilun , Xian, Jingwei, Stoyanov, Stoyan, Bailey, Christopher , Coyle, Richard , Gourlay, Christopher , Dunne, Fionn , Nokia Bell Labs, Murray Hill, New Jersey, USA (2022), A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints. Elsevier. In: , , , . Elsevier, International Journal of Plasticity, 155: 103308 ISSN: 0749-6419 (Print), (doi: https://doi.org/10.1016/j.ijplas.2022.103308).
Santhanakrishnan, Mani Sekara , Tilford, Tim, Bailey, Chris (2021), Multi-objective NSGA-II based shape optimisation of the cross-sectional shape of passively cooled heat sinks. Emerald. In: , , , . Emerald, International Journal of Numerical Methods for Heat and Fluid Flow, 32 (3) . pp. 1025-1045 ISSN: 0961-5539 (Print), (doi: https://doi.org/10.1108/HFF-10-2020-0656).
Tilford, Tim , Stoyanov, Stoyan, Braun, Jessica, Janhsen, Jan Christoph , Patel, Mayur K. , Bailey, Chris (2021), Comparative reliability of inkjet-printed electronics packaging. IEEE. In: , , , . IEEE, IEEE Transactions on Components, Packaging and Manufacturing Technology, 11 (2) . pp. 351-362 ISSN: 2156-3950 (Print), 2156-3985 (Online) (doi: https://doi.org/10.1109/TCPMT.2021.3049952).
Conference item
Malik, Asif , Rajaguru, Pushparajah, Azzawi, Rula (2022), Smart manufacturing with Artificial Intelligence and digital twin: a brief review. In: 8th International Conference on Information Technology Trends, 25th - 26th May 2022, Dubai, UAE , . , (doi: https://easychair.org/cfp/ITT2022).
Conference proceedings
Stoyanov, Stoyan and , Bailey, Chris (2022), Deep learning modelling for composite properties of PCB conductive layers. Institute of Electrical and Electronics Engineers (IEEE). In: , , , 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE. Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey (1st) . pp. 1-7 . ISBN: 9781665458375 (doi: https://doi.org/10.1109/EuroSimE54907.2022.9758885).
Stoyanov, Stoyan , Stewart†, Paul, Bailey, Christopher (2021), Reliability optimisation and lifetime modelling of micro-BGA assemblies in harsh environment applications. Institute of Electrical and Electronics Engineers (IEEE). In: , , In: Paul Stewart (ed.), 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC). 13-16 Sept. 2021. Gothenburg, Sweden. Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey (1st) . pp. 1-8 . ISBN: 9780956808677 ; 9781665423687 (doi: https://doi.org/10.23919/EMPC53418.2021.9584970).